Good news from China's scientific research field! China Greatwall Technology Group officially announced that after its Zhengzhou Rail Transit Information Technology Research Institute and Henan General Intelligent Equipment Co., Ltd. have jointly tackled key problems for one year, China’s first semiconductor laser invisible wafer dicing machine has been successfully developed on May 8, filling the domestic gap. It has achieved the best light wave and cutting technology, and is in the international leading level in key performance parameters.
China Greatwall said that this marks a substantial breakthrough in China's semiconductor laser invisible wafer dicing technology, and the dependence on imports of related equipment is about to break, opening the prelude to the development of China's laser wafer dicing industry.
It is reported that Zhengzhou Rail Transit Institute was established in 2017. For several years, it has been carrying out scientific research, innovating and making technological breakthroughs in autonomous safety industrial controllers, high-end equipment manufacturing, and a new generation of information technology breakthroughs. After being acquired by a company under China Greatwall, Zhengzhou Rail Transit Institute has entered a new round of accelerating development.
According to reports, wafer dicing is an indispensable key process in the semiconductor packaging and testing process. Compared with traditional cutting methods, laser cutting is non-contact processing, which can avoid damage to the surface of crystalline silicon. Laser cutting also possesses characteristics of high processing accuracy and efficiency, which can significantly improve the quality, efficiency and benefit of chip manufacturing.
